Failure analysis - Company Ranking(3 companies in total)
Last Updated： Aggregation Period:Dec 31, 2025〜Jan 27, 2026
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Display Company Information
| Company Name | Featured Products | ||
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| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| For more details, please download the PDF or feel free to contact us. | For more details, please download the PDF or feel free to contact us. | ||
| - Package condition: Opened chip, single chip, back surface polishing of wafer state Si chip size: 200um to 15mm - IR-OBIRCH analysis: ... | - Defects caused by bonding: Attack by foreign substances, cracks due to stress - Defects caused by the IC process: Layer patterning, sourc... | ||
LED failure analysis
Other |
For more details, please refer to the PDF document or feel free to contact us. | For more details, please refer to the PDF document or feel free to contact us. | |
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- Featured Products
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Specification verification and failure analysis through reliability testing.
- overview
- For more details, please download the PDF or feel free to contact us.
- Application/Performance example
- For more details, please download the PDF or feel free to contact us.
Failure analysis of power devices
- overview
- - Package condition: Opened chip, single chip, back surface polishing of wafer state Si chip size: 200um to 15mm - IR-OBIRCH analysis: ...
- Application/Performance example
- - Defects caused by bonding: Attack by foreign substances, cracks due to stress - Defects caused by the IC process: Layer patterning, sourc...
LED failure analysis
- overview
- For more details, please refer to the PDF document or feel free to contact us.
- Application/Performance example
- For more details, please refer to the PDF document or feel free to contact us.
-
アイテス
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